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Catalog, Quote, Availability.
Heat Sink Extrusion Profiles and
Custom Fabricated Assemblies
Wakefield Engineering heat sink extrusion profiles simplify the selection task and lower the cost of customizing a heat sink for an application undertaken by the OEM design engineer. We can also tailor a design to meet specific needs. These customized solutions serve two types of applications:
Customized heat sinks designed to mount and cool arrays of power semiconductors for use within power supplies, enclosures, and equipment cabinets. We can reduce total component cost by supplying a common extrusion profile, which we can machine for mounting requirements for an array of heat generating components.
Custom extruded aluminum enclosure panels, power supply base plates and side walls, and instrument front panels. Specify Wakefield Engineering for high-quality finished aluminum enclosure components when aesthetic appearance and finish quality are important to the appearance of your end product. Our finished product costs are competitive and often yield a higher quality solution.
Compression Mounting Clamp Assemblies
Each complete Wakefield Engineering Compression Mounting Clamp and Crossbar Assembly (130-D left and 130-A right) consists of one epoxy-coated steel crossbar and one matching spring assembly, each of which must be specified and ordered separately. Crossbar part numbers are indicted with an alpha character suffix (e.g., 130-A) and spring assembly part numbers are indicated with a numeric character suffix (e.g., 130-1).
Clamp Assembly Maximum Clamping Maximum Diameter (Ref) Crossbar Stud Centerline
Series Force Range SCR Power Disc. to Centerline Dimension
130 Series 800 lbs ( 362 kg) - 2,000 lbs (907 kg) 2.25 in. (57.1 mm) 2.75 in. ( 69.9 mm)Ref
139 Series 3,000 lbs (1,360 kg) - 5,000 lbs (2268 kg) 3.50 in. (88.1 mm) 4.00 in. (101.6 mm)Ref
144 Series 1,000 lbs ( 453 kg) - 6,000 lbs (2721 kg) 4.00 in. (101.6 mm) 4.625 in. (117.5 mm)Ref
145 Series 2,000 lbs ( 907 kg) - 10,000 lbs (4530 kg) 4.50 in. (114.3 mm) 5.500 in. (139.7 mm)Ref
PRODUCT SELECTION GUIDE
(See Also POWER SEMICONDUCTOR HEAT SINK SELECTION GUIDE below)
Wakefield Engineering's design, analysis, manufacturing, and fabrication expertise provides innovative thermal management solutions for standard and custom heat dissipation products, hardware, panels, enclosures and accessory products serving commercial, military, and industrial markets.
A broad range of board level heat sinks for surface mount and thru hole devices including D2 Pak, TO-3 to T0-247, DO-4 to DO-11, hex-type, stud mount and multiwatt devices packaged in industry standard plastic, ceramic, and metal case styles are offered. Thermal management solutions for increased power densities for devices such as power modules, IGBTs, SSRs, and other general purpose devices are satisfied with extruded heat sinks, bonded fin heat sinks, extrusion profiles, forced convection assemblies, convoluted fin design, and active cooling products. For compression pack devices, a comprehensive line of precision compression clamp systems and press pack heat sinks are offered. Accessory products include thermal compounds, coatings, casting resins, adhesives, interface materials, wafers, washers, brackets adapters, wavesolderable fasteners, hardware, installation tools, and engineering evaluation kits. Refer to each section for complete information or contact your local Sales Representative for assistance.
Board Level and Extruded
Heat Sinks for Power
Board Level Power Extruded Heat Sinks for Semiconductors
Semiconductor Heat Sinks Power Semiconductors Compatible Package
Series Page Series Page Series Page Series Page
200 50 290 56 131 172 435 66 D2Pak TO-38 TO-202
216 44-45 291 53 132 172 441 66 TO-3 TO-39 TO-218
225 51 292 51 133 172 465 67 TO-5 TO-43 TO-220
254 46 295 54 301 64 476 67 TO-11 TO-44 TO-247
256 46 296 52 302 64 486 67 TO-12 TO-45 Multiwatt
258 51 297 57 303 64 489 67 TO-18 TO-66 DO-4
259 46 298 52 382 71 490 68 TO-24 TO-92 DO-5
260 47-49 3305C 58 394 69 502 68 TO-26 TO-123 DO-7
270 55 601 62 395 69 503 68 TO-28 TO-124 DO-9
271 55 603 62 396 69 505 68 TO-29 TO-126 DO-10
272 55 626 58 401 65 510 70 TO-33 TO-127 DO-11
273 56 627 58 403 65 511 70 TO-36 TO-136
274 56 635 62 413 65 512 70
275 53 637 58 421 65 621 64
280 55 647 60 423 65 623 61 Thermal Links
281 56 657 59 431 66 641 64 Hex Type
285SC 58 667 58 433 66 Stud Mount
286 57 677 60 Compression PackDevices
287 57 680 61 Flat Base Block Devices
288 54 690 61
289 56 695 52
1996 Wakefield Engineering Catalog page numbers
HEAT SINK SELECTION GUIDE
Wakefield Engineering's design, manufacture, and fabrication
expertise offers a wide range of standard and custom heat dissipation
products and accessories providing complete innovative thermal management
solutions for a diverse range of commercial, industrial and military
applications. For Board Level Power Semiconductor Heat Sinks and
Extruded Heat Sinks selection assistance as well as custom design
configurations, use the charts as well as the illustrations linked below. For additional information, refer to product reference
pages, contact our Applications Engineering Department, or call your local
Style Outlines (images like TO-5 above)
D Pak - TO-124 101k .gif,
TO-126 - DO-9 101k .gif,
DO-10 - misc. 101k .gif,
THERMAL COMPOUNDS, ADHESIVES,
INTERFACE MATERIALS, HARDWARE, INSTALLATION TOOLS
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 degrees Centrigrade/w for a 0.001 in. film with an area of one square inch. There is no measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal Resistivity graph).
Thermal joint compounds may be thinned with standard solvents such as chlorothene N.U. or lacquer thinner to reduce their viscosity to a desired consistency. When coating insulating wafers, it is easy to dip them into the compound and place them onto a piece of screen for a few minutes until the solvent evaporates before placing the wafer on the heat sink or semiconductor. When the joint compound is thinned, periodic agitation of the mixture may be necessary to prevent setting. Plastic syringes are often used to drop a 0.25 cc deposit on the bottom of the semiconductor. Place the device on the heat sink and the joint compound spreads evenly beneath the component.
© 1995 Wakefield Engineering