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WAKEFIELD ENGINEERING


THERMAL COMPOUNDS, ADHESIVES,
INTERFACE MATERIALS, HARDWARE, INSTALLATION TOOLS

The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05 degrees Centrigrade/w for a 0.001 in. film with an area of one square inch. There is no measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal Resistivity graph below).

Thermal joint compounds may be thinned with standard solvents such as chlorothene N.U. or lacquer thinner to reduce their viscosity to a desired consistency. When coating insulating wafers, it is easy to dip them into the compound and place them onto a piece of screen for a few minutes until the solvent evaporates before placing the wafer on the heat sink or semiconductor. When the joint compound is thinned, periodic agitation of the mixture may be necessary to prevent setting. Plastic syringes are often used to drop a 0.25 cc deposit on the bottom of the semiconductor. Place the device on the heat sink and the joint compound spreads evenly beneath the component.


TYPICAL VALUES FOR THERMAL RESISTANCE, CASE TO SINK WHEN THERMAL JOINT COMPOUNDS ARE USED

                                                                         Typical
                                                 Mounting Torque         Thermal
Case Style Characteristics                       in inch pounds           Resistance

TO-3                                                  8  (0.9)            0.09
TO-66                                                 9  (0.9)            0.14
TO-220                                                8  (0.9)            0.50
0.19  (4.8) stud x 0.44 (11.2) hex                   15  (1.7)            0.16
0.25  (6.4) stud x 0.69 (17.5) hex                   30  (3.39)           0.10
0.38  (9.7) stud x 1.06 (26.9) hex                   75  (3.47)           0.07
0.50 (12.7) stud x 1.06 (26.9) hex                  125 (14.12)           0.07
0.75 (19.1) stud x 1.25 (31.8) hex                  600 (67.79)           0.052


120 SERIES - THERMAL JOINT COMPOUND

Characteristic                                       Description

Volume Resistivity                                    5 x 10 ohm/cm
Dielectric Strength                                 225 volts/mil
Specific Gravity                                      2.1 min.
Thermal Conductivity                                  0.735 W/(m) (K)
                                                      5:1 (Btu) (in.)/(hr)(ft)
Thermal Resistivity (P)                              56 (degrees C) (in.)/watt
Bleed, % after 24 hrs at 200 degrees C                0.5
Evaporation, % alter 24 hrs at 200 degrees C          0.5
Color                                                opaque while
Shell life                                            5 years
Operating Temperature Range (degrees C)             -40/+200


120 SERIES - ORDER GUIDE

Series -
P/N                Container Size

120-SA*            4 gram plastic pak
120-2*             2 oz (0.06 kg) jar
120-5*             5 oz (0.14 kg) tube
120-8*             8 oz (0.23 kg) jar
120-80*            5 1b (2.27 kg) can
120-320            20 1b (9.07 kg) can


© 1995 Wakefield Engineering
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